 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6606 Issued Date : 1993.03.15 Revised Date : 2002.01.15 Page No. : 1/4 HSD1609 NPN EPITAXIAL PLANAR TRANSISTOR Features * Low frequency high voltage amplifier * Complementary pair with HSB1109 Absolute Maximum Ratings (Ta=25C) TO-126ML * Maximum Temperatures Storage Temperature ............................................................................................ -50 ~ +150 C Junction Temperature .................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) .................................................................................. 1.25 W * Maximum Voltages and Currents BVCBO Collector to Base Voltage..................................................................................... 160 V BVCEO Collector to Emitter Voltage.................................................................................. 160 V BVEBO Emitter to Base Voltage............................................................................................ 5 V IC Collector Current........................................................................................................ 100 mA Electrical Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO *VCE(sat) VBE(on) *hFE1 *hFE2 fT Cob Min. 160 160 5 60 30 145 Typ. 3.8 Max. 10 2 1.5 320 Unit V V V uA V V Test Conditions IC=10uA IC=1mA IE=10uA VCB=140V IC=30mA, IB=3mA IC=10mA, VCE=5V IC=10mA, VCE=5V IC=1mA, VCE=5V IC=10mA , VCE=5V VCB=10V, f=1MHz *Pulse Test : Pulse Width 380us, Duty Cycle2% MHz pF Classification Of hFE1 Rank Range B 60-120 C 100-200 D 160-320 HSD1609 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 10000 1000 Spec. No. : HE6606 Issued Date : 1993.03.15 Revised Date : 2002.01.15 Page No. : 2/4 Saturation Voltage & Collector Current 125 C 75 C o hFE 25 C 100 o Saturation Voltage (mV) 1000 o 100 125 C o 75 C o 10 hFE @ VCE=5V 1 0.1 1 10 100 1000 25 C VCE(sat) @ IC=10IB o 10 0.1 1 10 100 1000 Collector Current IC (mA) Collector Current IC (mA) Saturation Voltage & Collector Current 10000 1000 ON Voltage & Collector Current 25 C o Saturation Voltage (mV) ON Voltage (mV) 1000 125 C o 75 C o 100 125 C 75 C 25 C VCE(sat) @ IC=20IB o o o VBE(ON) @ IC=5V 10 0.1 1 10 100 1000 10000 100 0.1 1 10 100 1000 Collector Current IC (mA) Collector Current IC (mA) Cutoff Frequency & Collector Current 1000 10 Capacitance & Reverse-Biased Voltage Cutoff Frequency (MHz). . 100 VCE=5V Capacitance (pF) Cob 10 1 10 100 1000 1 0.1 1 10 100 1000 Collector Current (mA) Reverse Biased Voltage (V) HSD1609 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6606 Issued Date : 1993.03.15 Revised Date : 2002.01.15 Page No. : 3/4 Safe Operating Area 10000 1000 Collector Current (mA) 100 PT=1ms 10 PT=100ms PT=1s 1 1 10 100 1000 Forward Voltage (V) HSD1609 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-126ML Dimension Marking: Spec. No. : HE6606 Issued Date : 1993.03.15 Revised Date : 2002.01.15 Page No. : 4/4 A H SD Rank Control Code B D E F 3 2 I G 1 J M L K O H Date Code 1609 C Style: Pin 1.Emitter 2.Collector 3.Base N 3-Lead TO-126ML Plastic Package HSMC Package Code: D *: Typical DIM A B C D E F G H Inches Min. Max. 0.1356 0.1457 0.0170 0.0272 0.0344 0.0444 0.0501 0.0601 0.1131 0.1231 0.0737 0.0837 0.0294 0.0494 0.0462 0.0562 Millimeters Min. Max. 3.44 3.70 0.43 0.69 0.87 1.12 1.27 1.52 2.87 3.12 1.87 2.12 0.74 1.25 1.17 1.42 DIM I J K L M N O Inches Min. Max. *0.1795 0.0268 0.0331 0.5512 0.5906 0.2903 0.3003 0.1378 0.1478 0.1525 0.1625 0.0740 0.0842 Millimeters Min. Max. *4.56 0.68 0.84 14.00 15.00 7.37 7.62 3.50 3.75 3.87 4.12 1.88 2.14 Notes: 1.Dimension and tolerance based on our Spec. dated Mar. 6,1995. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HSD1609 HSMC Product Specification |
Price & Availability of HSD1609
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |